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Process Equipment Product List and Ranking from 10 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

Process Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. 大村技研 Tokyo//Industrial Machinery
  2. Siconnex Japan(サイコネックス ジャパン) Tokyo//Industrial Machinery
  3. エイ・エス・エイ・ピイ Saitama//Electronic Components and Semiconductors
  4. 4 メープル Kanagawa//Ferrous/Non-ferrous metals
  5. 4 ソフエンジニアリング Saitama//Industrial Electrical Equipment
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Process Equipment Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. Thin Film Electronic Component Engineering "Photolithography Process Equipment" 大村技研
  2. Fully automatic lithography system for automatic coating, exposure, and development process. エイ・エス・エイ・ピイ
  3. Siconnex Company Profile Siconnex Japan(サイコネックス ジャパン)
  4. Multi-Vacuum Process Equipment メープル
  5. 4 New type UDS spin sheet device (etching, RCA, cleaning, developing, etc.) ソフエンジニアリング

Process Equipment Product List

1～11 item / All 11 items

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Fully automatic lithography system for automatic coating, exposure, and development process.

Fully automatic lithography system for automatic coating, exposure, and development process.

Coating the resist, exposure, and developing process are all done in one go. It is a device that can process automatically. This is a special device made possible by being a comprehensive manufacturer of photolithography equipment.

This product is a device that automatically performs spin coating, batch exposure, and development processing. It can be equipped with HMDS treatment, baking, and cooling functions. This device has been made possible because our company handles everything from design to manufacturing and sales, offering a lineup of photolithography equipment including coaters, aligners, and developers. The supported resists include positive and negative resists, polyimide, and various other chemicals have been successfully used. We also have extensive experience in transporting a wide range of substrates such as Si (silicon), GaAs, InP, GaN, SiC, sapphire, ceramics, and SiO2 (glass). The exposure process can be equipped with an auto-alignment function, making it ideal for positive-negative inversion processes as well. 【Features】 ■ Automatic batch processing of photolithography steps ■ Achieves low cost ■ Compatible with low to high viscosity (1.7cP to 10000cP) ■ Supports sizes from 2 to 6 inches, with proven capability for 4-inch ■ Automatic recognition of wafer sizes ■ Proven results with a variety of chemicals ■ Reduced footprint (space-saving) ■ Numerous options for resist reduction ■ Each process can operate independently ■ Auto-alignment function *For more details, please refer to the PDF document or feel free to contact us.

  • Coater

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MEMS development process equipment

MEMS development process equipment

MEMS development tools and precision alignment nanotech

In the "MEMS Development Process Equipment," we offer a variety of devices including the compact standard model for fine exposure, the "Single-Sided Mask Aligner," the low-cost assist model for double-sided processes, the "Front Mask Aligner," the standard mass production machine for double-sided and multi-sided processes, the "Simultaneous Double-Sided Exposure Mask Aligner," the custom equipment for automation and mass production, the "Auto Mask Aligner," the dedicated exposure device, the "Custom Mask Aligner," the alignment fixing device compatible with custom designs, the "Precision Alignment Holder" using a unique clamping mechanism, the "UV Nano Imprinter / Micro Contact Printer" for precise transfer with low residual film and low bubbles, the industry-standard "General Purpose Spray Coater," and the unique low-cost mask production machine, the "Simple Mask Production Machine," among many others. For more details, please contact us or refer to the catalog.

  • Other processing machines

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Wet Process Equipment K-150/200

Wet Process Equipment K-150/200

Wet process equipment K-150/200 (coating, developing, etching, stripping, cleaning)

The "K" series features new technologies and functions. It is an expandable wet processor that allows for easier and lower-cost upgrades to new workflows. It can be customized for any specifications in wet processes such as resist coating, developing, etching, stripping, and cleaning. We will develop the necessary functions through discussions with our customers, ensuring that we provide optimal equipment at a low cost without excessive specifications. Additionally, since both design and manufacturing are done in-house, we can respond quickly to specification changes after the equipment is installed.

  • Other process controls

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WET process equipment sheet-type spin processor

WET process equipment sheet-type spin processor

By placing multiple devices, it is possible to easily achieve multi-processing.

The WET process equipment single-wafer spin processor cleans and rinses the substrate through spin rotation and spraying, followed by drying with high-speed spin rotation. By arranging multiple units, it is easy to achieve multi-process operations (e.g., developing → etching → cleaning, drying). The WET equipment technology from Denshi Giken Co., Ltd., including spin cleaning, can meet the needs of various industries such as semiconductors, LCDs, medical, and food industries, by cleaning wafers, glass substrates, printed circuit boards, metal substrates, and more. 【Features】 ○ Excellent particle removal performance ○ Significant reduction in takt time through high-speed spin cleaning ○ Compact design achieved through space-saving For more details, please contact us or download the catalog.

  • Circuit board processing machine
  • Other cleaning machines

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[Book] Optimization of Separation Processes (No. 2028BOD)

[Book] Optimization of Separation Processes (No. 2028BOD)

【Specialized Books】◎ Crystallization, Filtration, Classification, Distillation, Concentration, Drying ⇒ Understand the characteristics and issues of each process, along with tips and know-how for optimizing conditions!

■ Points of this book 1. How to find optimal conditions for correctly separating the target substance - Improvement of yield and efficiency, quality and high purity of the refined product - How to read and utilize important physical property values when considering conditions - Basic calculation procedures in theoretical calculations 2. Proper approach and know-how for scale-up experiments - What data should be obtained in the lab? - How to consider actual production equipment in pilot studies? - Presentation of examples of material balance and energy balance predictions for each process! You will understand the necessary data and how to utilize it 3. Utilization of modeling and simulation - Presentation of examples of correlation and estimation of physical property values for each process! - Application to the design of continuous production processes - Comprehensive condition examination and optimization using informatics and AI 4. Trouble cases and countermeasures in each process - Crystallization - Control of nucleation and growth rate, contamination of crystals with impurities - Filtration - Causes and countermeasures for fouling, membrane degradation, and contamination - Classification - Aggregation, adhesion, wear of particles, classification accuracy - Concentration - Prevention of membrane fouling, cost issues - Drying - Variability in drying degree, adhesion of powder particles, caking of dried products

  • Technical and Reference Books

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Thin Film Electronic Component Engineering "Photolithography Process Equipment"

Thin Film Electronic Component Engineering "Photolithography Process Equipment"

For production equipment and research and development! Providing a series of processes in thin-film electronic component manufacturing!

Omura Giken's "Photolithography Process Equipment" is a system that provides a series of processes in thin-film electronic component manufacturing with high precision and reliability. We offer production equipment for cleaning, coating, developing, stripping, etching, as well as equipment for research and development. The "Fully Automatic Spin Etching Device" extracts wafers one by one, sprays chemicals while rotating, and automatically processes everything from etching to drying. [Features] ■ Provides a series of processes for thin-film electronic component manufacturing ■ Compatible with various equipment ■ Fully automatic spin etching device is also available in the lineup *For more details, please refer to the PDF document or feel free to contact us.

  • Coater
  • Resist Device
  • Etching Equipment

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Siconnex Company Profile

Siconnex Company Profile

100% focus on BATCHSPRAY technology! Significantly reduce water, exhaust, and chemicals.

Our company is a manufacturer of equipment for the semiconductor chip manufacturing process (wet etching, resist stripping, cleaning). We offer a variety of products, including the "BATCHSPRAY Clean Autoload" with a maximum throughput of 600 wph and the "BATCHSPRAY Solvent Autoload," which employs a chemical circulation system with a tank system. Please feel free to contact us when you need assistance. 【Reasons to Choose Siconnex】 ■ 100% focus on BATCHSPRAY technology ■ Significant reduction in water, exhaust, and chemicals ■ Cost-efficient processes that support environmental conservation ■ Comprehensive support system (service, parts, processes) ■ Partnership approach with free annual equipment inspections, training, telephone support, and regular maintenance in the first year *For more details, please refer to the PDF materials or feel free to contact us.

  • Other semiconductor manufacturing equipment

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Wet process equipment "BATCHSPRAY Acid"

Wet process equipment "BATCHSPRAY Acid"

100% focus on BATCHSPRAY technology! Significantly reduce water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Semi-automatic equipment.

Our semi-automatic device stands out for its high performance, efficient chemical recirculation, minimal installation area, and optimized space efficiency. 【Features】 ■ Throughput of up to 150 wph ■ Uniformity with less than 1% variation ■ Installation area of less than 2 m² ■ Chemical recirculation through a tank system ■ Process executable with SiC/GaN ■ Usable with chambers for 25 or 50 wafers ■ Extractable process chamber *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductor manufacturing equipment

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Special carbon products for semiconductor manufacturing process equipment.

Special carbon products for semiconductor manufacturing process equipment.

Melsen FMA Corporation supplies various products for semiconductor manufacturing process equipment and many other industries.

Graphite is the ideal material for applications that require heat resistance and corrosion resistance. In particular, the use of highly corrosion-resistant graphite is essential in applications that involve liquid chemicals or chemical gases.

  • Other semiconductor manufacturing equipment

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Multi-Vacuum Process Equipment

Multi-Vacuum Process Equipment

Cluster-type composite process device equipped with a vacuum transport robot.

Cluster-type composite process equipment capable of accommodating a total of six chambers, including a load lock chamber, around the center chamber. 【Features】 - Gate valves are placed between the center chamber and each chamber to prevent contamination. - Gate valves are integrated within the center chamber to save space. - The main pump is installed at the top of the chamber for high maintenance accessibility. - Equipped with a uniquely developed vacuum transport robot. - Each chamber is equipped with an independent vacuum exhaust system. - Features a sputtering film deposition unit with a film thickness distribution of ±3%. - Includes a lamp annealing unit capable of heating up to 1000°C. - Equipped with a cassette load lock chamber that can accommodate 13 φ300mm silicon wafers. For more functions and details, please download the catalog.

  • Hydraulic Equipment

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New type UDS spin sheet device (etching, RCA, cleaning, developing, etc.)

New type UDS spin sheet device (etching, RCA, cleaning, developing, etc.)

Significant reduction in footprint and purchase costs, increased throughput, and substantial improvement in substrate quality.

- Suitable for various WET processes such as etching, RCA cleaning, and developing. - A full process of "chemical solution ⇒ rinse ⇒ drying" is handled in a single chamber with Dry-In/Dry-Out. - Conventional method: 2-chamber configuration (the substrate remains in contact with the chemical solution during transfer between chambers). - New method: UDS type uses a 1-chamber configuration. - Basic operation of the substrate: - "Upper section… Substrate LD" ⇒ "Lower section… Chemical treatment" ⇒ - "Middle section… Rinse drying" ⇒ "Upper section… Substrate ULD" - The patented isolation plate ensures the concentration of the chemical solution during reuse. - There is no dilution from rinse water contamination. - For example, it can accommodate "Lower section… SPM treatment" and "Middle section… APM/MS." - The patented isolation plate completely separates and prevents the scattering of chemical gases and mists in the lower treatment section. - Chemical solution/rinse treatment can be performed on the backside of the substrate, ensuring it is contamination-free. - Shortening the manufacturing process significantly increases production efficiency and can greatly reduce cleanroom occupancy area. - A seamless process of etching ⇒ stripping is possible within a single system device. *For more details, please refer to the PDF document or feel free to contact us.*

  • Other semiconductor manufacturing equipment

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